Measuring arrangement in an injection-moulding system
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United States of America Patent
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Oct 9, 2012
Grant Date -
Sep 30, 2010
app pub date -
Oct 8, 2008
filing date -
Oct 22, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A measuring arrangement for measuring one or more pressures and/or temperatures in an injection-molding system includes a base plate and at least one mould insert with at least part of a cavity. The base plate and the mould insert rest against one another in a releasable manner on at least one common separating surface. The mould insert includes at least one sensor for detecting pressures and/or temperatures as well as a transmitter module on the separating surface, which transmitter module is electrically connected to the sensor. The base plate includes a receiving module on the separating surface opposite the transmitter module, wherein measurement data can be transmitted from the transmitter module to the receiving module. The transmitter module and the receiving module on the separating surface are essentially planar and can be separated without force.
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