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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
EPISTAR CORPORATION	21 LI-HSIN RD SCIENCE-BASED INDUSTRIAL PARK HSINCHU 300

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Chen, Ding-Yuan	Taichung, TW	64	636
# of filed Patents : 64 Total Citations : 636
Chiou, Wen-Chih	Miaoli, TW	414	9438
# of filed Patents : 414 Total Citations : 9438
Yu, Chen-Hua	Hsin-Chu, TW	2207	47923
# of filed Patents : 2207 Total Citations : 47923

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• H01L Class

• 0 % this patent is cited more than
• 13 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 02, 2012	US,8278679,B2   US8278679B2	GRANTED PATENT AS SECOND PUBLICATION
October 29, 2009	US,20090267105,A1   US20090267105A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 8278679

LED device with embedded top electrode

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Abstract

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An LED device and a method of manufacturing, including an embedded top electrode, are presented. The LED device includes an LED structure and a top electrode. The LED structure includes layers disposed on a substrate, including an active light-emitting region. A top layer of the LED structure is a top contact layer. The top electrode is embedded into the top contact layer, wherein the top electrode electrically contacts the top contact layer.

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Description

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Claims

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Legal Events

 

• LAPS2024
• STCH2024
• FP2024
• FEPP2024
• MAFP2020
• FPAY2016
• AS2015
• AS2015
• I2012
• STCF2012
• AS2012
• P2009
• AS2008
• F2008
• PD2008

Date	Code	Event	Description
Nov 04, 2024	LAPS	LAPSE FOR FAILURE TO PAY MAINTENANCE FEES	free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
Nov 04, 2024	STCH	INFORMATION ON STATUS: PATENT DISCONTINUATION	free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362
Oct 02, 2024	FP	LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE	Effective Date: Oct 02, 2024
May 20, 2024	FEPP	FEE PAYMENT PROCEDURE	free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
Mar 19, 2020	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 8
Mar 16, 2016	FPAY	FEE PAYMENT	year of fee payment: 4
Jul 15, 2015	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LTD., CHIP STAR;REEL/FRAME:037219/0925 Owner name: EPISTAR CORPORATION, TAIWAN Effective Date: Jul 15, 2015
Apr 02, 2015	AS	ASSIGNMENT	free format text: CHANGE OF NAME;ASSIGNOR:LTD., TSMC SOLID STATE LIGHTING;REEL/FRAME:037809/0914 Owner name: CHIP STAR LTD., TAIWAN Effective Date: Apr 02, 2015
Oct 02, 2012	I	Issuance
Sep 12, 2012	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Mar 01, 2012	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.;REEL/FRAME:027856/0406 Owner name: TSMC SOLID STATE LIGHTING LTD., TAIWAN Effective Date: Mar 01, 2012
Oct 29, 2009	P	Published
Sep 24, 2008	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YU, CHEN-HUA;CHEN, DING-YUAN;CHIOU, WEN-CHIH;REEL/FRAME:021940/0333 Owner name: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Effective Date: Sep 24, 2008
Sep 22, 2008	F	Filing
Apr 29, 2008	PD	Priority Date