Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon

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United States of America Patent

PATENT NO 8278659
APP PUB NO 20100032586A1
SERIAL NO

12567414

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Methods for processing an amorphous silicon thin film sample into a polycrystalline silicon thin film are disclosed. In one preferred arrangement, a method includes the steps of generating a sequence of excimer laser pulses, controllably modulating each excimer laser pulse in the sequence to a predetermined fluence, homogenizing each modulated laser pulse in the sequence in a predetermined plane, masking portions of each homogenized fluence controlled laser pulse in the sequence with a two dimensional pattern of slits to generate a sequence of fluence controlled pulses of line patterned beamlets, each slit in the pattern of slits being sufficiently narrow to prevent inducement of significant nucleation in region of a silicon thin film sample irradiated by a beamlet corresponding to the slit, irradiating an amorphous silicon thin film sample with the sequence of fluence controlled slit patterned beamlets to effect melting of portions thereof corresponding to each fluence controlled patterned beamlet pulse in the sequence of pulses of patterned beamlets, and controllably sequentially translating a relative position of the sample with respect to each of the fluence controlled pulse of slit patterned beamlets to thereby process the amorphous silicon thin film sample into a single or polycrystalline silicon thin film.

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Patent Owner(s)

Patent OwnerAddress
THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORKNEW YORK NY 10027

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Crowder, Mark A New York, US 36 754
Im, James S New York, US 82 2465
Sposili, Robert S New York, US 27 799

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