Polishing pad and polishing device
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United States of America Patent
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Oct 2, 2012
Grant Date -
Oct 28, 2010
app pub date -
Aug 31, 2009
filing date -
Apr 24, 2009
priority date (Note) -
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Abstract
A polishing pad used in semiconductor polishing process is provided in the present invention and a pressure sensitive adhesive is used to couple the polishing pad. The polishing pad includes a substrate, and the substrate includes a polishing surface and a reverse surface corresponding to the polishing surface. The polishing pad is characterized by: a pressure sensitive adhesive formed on the reverse surface of the substrate and used to couple with a bottom layer, and the horizontal adhesion of the pressure sensitive adhesive is higher than the vertical adhesion of the pressure sensitive adhesive.
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