Device and method for cutting off substrate of fragile material
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United States of America Patent
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Oct 2, 2012
Grant Date -
Mar 18, 2010
app pub date -
May 26, 2006
filing date -
May 30, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented.
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