Flux-free chip to substrate joint serial linear thermal processor arrangement
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United States of America Patent
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Sep 25, 2012
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N/A
app pub date -
Jan 7, 2011
filing date -
Jul 1, 2002
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Abstract
A linear, serial chip/substrate assembly processing machine for stepwise advancing a pre-assembled chip/die substrate on a support plate through a series of sealable chambers beginning at a loading station and ending up at an unloading station after various melting and vacuuming of chip/substrate components has been stepwise indexed through those various chambers to the final joining thereof.
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