Semiconductor device with interface peeling preventing rewiring layer
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United States of America Patent
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Sep 25, 2012
Grant Date -
Mar 31, 2011
app pub date -
Dec 2, 2010
filing date -
Jul 13, 2006
priority date (Note) -
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Abstract
A semiconductor device which is capable of preventing interface peeling and a crack from occurring in the vicinity of the edge part of a rewiring layer is provided. The semiconductor device includes a semiconductor substrate, an electrode pad formed on the semiconductor substrate, a first insulation film formed on the semiconductor substrate having a first aperture which exposes the electrode pad, a first conductor film formed on the electrode pad and the first insulation film, an external electrode electrically connected to the first conductor film, and a sealing resin which covers the first conductor film and the first insulation film. The first conductor film includes a plurality of copper layers which are stacked so that an outer edge portion of the first conductor film has a stepped portion.
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