Method and apparatus for multilayer support substrate
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United States of America Patent
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Sep 18, 2012
Grant Date -
Mar 3, 2011
app pub date -
Aug 25, 2009
filing date -
Aug 25, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon.
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