Method and apparatus for laser soldering
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United States of America Patent
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Sep 18, 2012
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N/A
app pub date -
Jun 15, 2009
filing date -
Jun 30, 2008
priority date (Note) -
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Abstract
In accordance with an aspect of the invention, a solder paste feeding device feeds solder paste to a ring-like terminal surrounding a through-hole and a rod terminal fitted in the through-hole so as to fill in the through-hole, the laser beam irradiation device irradiates the solder past with a laser beam, and wire solder is further fed from above the solder past at the same time as melting of the solder paste is started, thereby fusing the wire solder and the solder paste to solder the ring-like terminal and the rod terminal.
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