Semiconductor device manufacturing method and method for reducing microroughness of semiconductor surface
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United States of America Patent
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Sep 18, 2012
Grant Date -
Jan 22, 2009
app pub date -
Jan 30, 2007
filing date -
Feb 1, 2006
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Abstract
Surface treatment is performed with a liquid, while shielding a semiconductor surface from light. When the method is employed for surface treatment in wet processes such as cleaning, etching and development of the semiconductor surface, increase of surface microroughness can be reduced. Thus, electrical characteristics and yield of the semiconductor device are improved.
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