Destructor integrated circuit chip, interposer electronic device and methods
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United States of America Patent
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Sep 18, 2012
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N/A
app pub date -
Apr 9, 2010
filing date -
Jan 25, 2005
priority date (Note) -
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Abstract
A method of fabricating an electronic circuit including forming a first depression on a first surface of a first wafer and forming a second depression on the first surface of the first wafer. The second depression is adjacent the first depression and separated from the first depression by a wall. The method further includes locating an actuator on the wall and attaching a first surface of a second wafer to the first surface of the first wafer to cover the first and second depressions. A first portion of the second wafer and the first depression define a first reservoir to contain a first chemical, and a second portion of the second wafer and the second depression define a second reservoir to contain a second chemical.
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