Plating bath and method
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United States of America Patent
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Sep 11, 2012
Grant Date -
Sep 15, 2011
app pub date -
Mar 15, 2010
filing date -
Mar 15, 2010
priority date (Note) -
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Abstract
Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
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