Printed circuit board with improved via design
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United States of America Patent
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Sep 4, 2012
Grant Date -
Jan 21, 2010
app pub date -
Aug 27, 2009
filing date -
Jun 27, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.
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