Thermosetting resin compositions and articles
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United States of America Patent
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Sep 4, 2012
Grant Date -
Mar 3, 2011
app pub date -
Aug 27, 2010
filing date -
Aug 28, 2009
priority date (Note) -
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Abstract
The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz.
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