Flux-free chip to wafer joint serial thermal processor arrangement
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United States of America Patent
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Aug 28, 2012
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app pub date -
Dec 31, 2010
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Jul 1, 2002
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Abstract
A serial thermal processing arrangement for treating a pre-assembled chip/wafer assembly of semiconductor material in a rotary processor, through a series of intermittent, rotatively advanced, movements into independent, temperature and pressure controlled, circumferentially disposed chambers.
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