Package structure of photodiode and forming method thereof
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United States of America Patent
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Aug 28, 2012
Grant Date -
Apr 21, 2011
app pub date -
Oct 14, 2010
filing date -
Oct 16, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A package structure of photodiode and a forming method of the same are provided. The method includes providing a heat-dissipation plate; placing a circuit board on the heat-dissipation plate, the circuit board having an opening exposing a top surface of the heat-dissipation plate and a first contact pad located on a peripheral area of the opening; placing a carrier with a metal cladding surface into the opening, the carrier connecting the top surface of the heat-dissipation plate; placing a photodiode chip on the carrier wherein the bottom area of the photodiode chip is less than the metal cladding surface such that a portion of the metal cladding surface is exposed; and electrically connecting the exposed metal cladding surface to the first contact pad.
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