Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate

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United States of America Patent

PATENT NO 8247703
SERIAL NO

12938759

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Abstract

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A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a ferroelectric ceramic and/or a high surface area ceramic and/or a transparent oxide and/or a dope manganite. Alternatively, the material will include the polymer resin and nano-powders, with the nano-powders comprising at least one metal coated ceramic and/or at least one oxide coated metal component. An electrical assembly (substrate and at least one electrical component) and an information handling system (e.g., personal computer) utilizing such a circuitized substrate are also provided.

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Patent Owner(s)

Patent OwnerAddress
I3 ELECTRONICS INC1701 NORTH STREET ENDICOTT NY 13760

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Das, Rabindra N Vestal, US 53 1420
Lauffer, John M Waverly, US 123 2396
Markovich, Voya R Endwell, US 198 5225

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