BSC macrostructure for three-dimensional wiring and substrate having the BSC macrostructure

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Aug 14, 2012
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Sep 17, 2009
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Mar 17, 2008
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Mar 17, 2008

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Abstract

A BSC macrostructure for three-dimensional wiring includes a BSC (boundary scan cell) and an aperture electrode for electrode connection which is connected to the BSC.

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Patent Owner	Address
LIQUID DESIGN SYSTEMS INC	2-3-4 SHINYOKOHAMA KOHOKU-KU YOKOHAMA-CITY KANAGAWA 222-0033

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Inventor Name	Address	# of filed Patents	Total Citations
Oyamada, Seisei	Tokyo, JP	15	139

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BSC macrostructure for three-dimensional wiring and substrate having the BSC macrostructure

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United States of America Patent

12077179

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PATENT NO	8243245
APP PUB NO	20090235135A1
SERIAL NO	12077179
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 14, 2012	US,8243245,B2 US8243245B2	GRANTED PATENT AS SECOND PUBLICATION
September 17, 2009	US,20090235135,A1 US20090235135A1	FIRST PUBLISHED PATENT APPLICATION

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12077179

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