Chip-level through hole structure of electronic package
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United States of America Patent
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-
Aug 14, 2012
Grant Date -
Jan 22, 2009
app pub date -
Sep 17, 2007
filing date -
Jul 20, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference.
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