Methods and apparatus for modifying gel adhesion strength
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United States of America Patent
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Aug 14, 2012
Grant Date -
May 7, 2009
app pub date -
Nov 1, 2005
filing date -
Nov 1, 2004
priority date (Note) -
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Abstract
The invention concerns a method for controlling the adhesive bond between an electric-field responsive material and a substrate, which method comprises using an electric field to control the strength and integrity of the adhesive bond. The method may be used, for example, for removing or delaminating a material, which material is responsive to an electric field, from a substrate. The invention further comprises elimination of the application of the electric field and application of the previously removed electric-field-responsive material to the substrate, thereby resuming the strength and integrity of the adhesive bond. The invention includes apparatus for use in the bond controlling process.
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