Light emitting diode module and method for making the same
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United States of America Patent
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Aug 14, 2012
Grant Date -
Jun 30, 2011
app pub date -
Dec 15, 2010
filing date -
Dec 25, 2009
priority date (Note) -
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Abstract
A light emitting diode module includes: a printed circuit board including an upper circuit layer, a lower metal layer, an insulating layer, and a plurality of through holes; a metallic heat sink formed with a plurality of chip-support portions and disposed below the printed circuit board; a thermal connection layer that has lower and upper surfaces respectively bonded to the heat sink and the lower metal layer of the printed circuit board; and a plurality of light emitting diode chips, each of which is placed in contact with and bonded to one of the chip-support portions and each of which is electrically connected to the upper circuit layer. A method for making the light emitting diode module is also disclosed.
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