Method of making circuitized substrates having film resistors as part thereof
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United States of America Patent
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Aug 14, 2012
Grant Date -
Jul 16, 2009
app pub date -
Jan 16, 2008
filing date -
Jan 16, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making a circuitized substrate which involves forming a plurality of individual film resistors having approximate resistance values as part of at least one circuit of the substrate, measuring the resistance of a representative (sample) resistor to define its resistance, utilizing these measurements to determine the corresponding precise width of other, remaining film resistors located in a defined proximity relative to the representative resistor such that these remaining film resistors will include a defined resistance value, and then selectively isolating defined portions of the resistive material of these remaining film resistors while simultaneously defining the precise width of the resistive material in order that these film resistors will possess the defined resistance.
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