Sputtering target assembly and method of making same

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United States of America Patent

PATENT NO 8235277
SERIAL NO

13231237

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Abstract

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A method for producing a sputtering target assembly bonded to a backing plate. The method includes bonding a target to a high strength backing plate and further creating a vacuum seal between the target and the backing plate using friction stir welding processes.

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Patent Owner(s)

Patent OwnerAddress
TOSOH SMD INCGROVE CITY OH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ivanov, Eugene Y Grove City, US 46 502
Theado, Erich Columbus, US 8 22

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