Method and apparatus for accurately applying structures to a substrate
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United States of America Patent
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Jul 31, 2012
Grant Date -
Jul 3, 2008
app pub date -
Apr 22, 2005
filing date -
Apr 23, 2004
priority date (Note) -
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Abstract
A method wherein a substrate is provided, wherein, in a scanning step, structures already applied to the substrate are detected by at least one scanning provision of a processing head, wherein the processing head is provided with at least one lighting provision, which lighting provision locally lights the applied lacquer structure in a lighting step by using the information obtained with the scanning step. Further, the invention discloses an apparatus for carrying out the method is described, which apparatus is provided with a processing head which is movable relative to a substrate carrier, wherein the processing head comprises at least one scanning provision and at least one lighting provision.
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