Method for fabricating an electronic device substrate
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United States of America Patent
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-
Jul 31, 2012
Grant Date -
Aug 28, 2008
app pub date -
Apr 17, 2008
filing date -
Mar 17, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is mounted the electronic component, and which is provided to surround the metal electrode.
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