Semiconductor device and manufacturing method thereof, and camera module including the same
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United States of America Patent
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Jul 24, 2012
Grant Date -
Sep 22, 2011
app pub date -
May 27, 2011
filing date -
Dec 7, 2007
priority date (Note) -
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Abstract
A semiconductor device includes: an insulating base; a semiconductor element provided on the insulating base; a protector provided on the semiconductor element; and a frame provided on a periphery of the insulating base and surrounding the semiconductor element. A region inside the frame is filled with a sealing resin, and at least one groove is provided in an upper corner portion of the frame on the semiconductor element side of the frame.
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