Forming a copper diffusion barrier
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United States of America Patent
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Jul 24, 2012
Grant Date -
Dec 27, 2007
app pub date -
Aug 31, 2007
filing date -
Oct 31, 2002
priority date (Note) -
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Abstract
Noble metal may be used as a non-oxidizing diffusion barrier to prevent diffusion from copper lines. A diffusion barrier may be formed of a noble metal formed over an adhesion promoting layer or by a noble metal cap over an oxidizable diffusion barrier. The copper lines may also be covered with a noble metal.
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