Method and composition for cleaning wafers
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United States of America Patent
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Jul 24, 2012
Grant Date -
Jun 18, 2009
app pub date -
Dec 8, 2008
filing date -
Dec 7, 2007
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Abstract
A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a semiconductor wafer. The cleaning solution comprises a polycarboxylate polymer or an ethoxylated polyamine. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of a polycarboxylate polymer or an ethoxylated polyamine. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.
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