Method transparent member, optical device using transparent member and method of manufacturing optical device
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United States of America Patent
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Jul 17, 2012
Grant Date -
Oct 30, 2008
app pub date -
Jun 27, 2008
filing date -
Oct 7, 2004
priority date (Note) -
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Abstract
In a method of manufacturing an optical device, a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a plurality of optical devices, respectively. A plurality of chips are then mounted to the plurality of regions, respectively. A whole sealing member having a plurality of sealing members is integrally attached to the whole substrate to form an intermediate body. The intermediate body is divided into the above-described regions. Thus, the optical device having a substrate, a chip as an optical element mounted to the substrate and a sealing member with transparency provided at the substrate for the purpose of sealing the chip is manufactured. This manufacturing method improves the efficiency of manufacturing an optical device.
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