System for peeling semiconductor chips from tape
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United States of America Patent
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Jul 17, 2012
Grant Date -
Jul 24, 2008
app pub date -
Jan 22, 2008
filing date -
Jan 20, 2007
priority date (Note) -
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Abstract
A semiconductor system for peeling semiconductor chips from tape, comprising: providing an outer housing having an aperture on a top thereof; providing a magnet with a needle base extension; providing needles magnetically held to the magnet; applying a vacuum through the aperture to hold an adhesive material to the outer housing; and extending the needles through the aperture in the outer housing.
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