Taphole fill material and method for manufacturing the same

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United States of America Patent

PATENT NO 8216954
APP PUB NO 20120046155A1
SERIAL NO

13288119

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A high-temperature, heat-resistant fill material is disclosed. The high-temperature, heat-resistant fill material includes an alumina refractory waste material having one or more of a used alumina-magnesium-carbon material, a used high-alumina material and a used fused-grain alumina material is disclosed. A method for method for manufacturing a material is also disclosed.

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Patent Owner(s)

Patent OwnerAddress
EDW C LEVY CODETROIT MI 48209

International Classification(s)

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  • 2011 Application Filing Year
  • C21C Class
  • 63 Applications Filed
  • 51 Patents Issued To-Date
  • 80.96 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201120122013201420152016201720180255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dunn, Thomas M Hilltop Lakes, US 13 207

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Patent Citation Ranking

  • 2 Citation Count
  • C21C Class
  • 23.81 % this patent is cited more than
  • 13 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1031101 - 1011 - 200246810121416182022242628303234

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