Contact structure and forming method thereof and connecting structure thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 10, 2012
Grant Date -
Oct 1, 2009
app pub date -
Jun 24, 2008
filing date -
Mar 27, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A contact structure disposed on a substrate is provided. The contact structure includes a pad, a polymer bump and a conductive layer. The pad is on the substrate. The polymer bump having a curve surface and a steep surface connecting with the curve surface is disposed on the substrate. The polymer bump is covered by the conductive layer and the conductive layer is electrically connected with the pad.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully