Multilayered circuitized substrate with P-aramid dielectric layers and method of making same
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United States of America Patent
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Jul 3, 2012
Grant Date -
Jul 9, 2009
app pub date -
Mar 2, 2009
filing date -
Mar 23, 2005
priority date (Note) -
Expired
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Abstract
A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
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