Gypsum-based building material having increased thermal conductivity and shielding attenuation, method for producing the building material, molding containing the building material and method for producing the molding
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United States of America Patent
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Jul 3, 2012
Grant Date -
Feb 8, 2007
app pub date -
Aug 4, 2006
filing date -
Aug 4, 2005
priority date (Note) -
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Abstract
A gypsum-based building material having increased thermal conductivity and shielding attenuation, a method for producing the building material, a molding containing the building material and a method for producing the molding are provided. The products and methods include adding ground stock formed of compacted expanded graphite to gypsum-based building materials in order to increase the thermal conductivity and the electromagnetic shielding attenuation of the building materials and moldings, for example gypsum cardboards, produced therefrom.
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