Techniques for direct encasement of circuit board structures
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United States of America Patent
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Jul 3, 2012
Grant Date -
Feb 5, 2009
app pub date -
May 20, 2008
filing date -
Jul 31, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A technique for processing an electronic apparatus (e.g., manufacturing an assembled circuit board, treating an assembled circuit board, etc.) involves applying encasement material to an area of the circuit board assembly while leaving at least a portion of the circuit board assembly exposed. The technique further involves causing the applied encasement material to harden (e.g., heating the encasement material in a curing oven, applying radiation, providing a chemical catalyst, etc.). Application and hardening of the encasement material may take place shortly after circuit board assembly (e.g., by automated equipment at a manufacturing facility in order to treat newly assembled boards) or at some later time in the field (e.g., by a technician servicing a legacy board).
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