Electronic device and heat dissipation apparatus of the same
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United States of America Patent
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Jun 26, 2012
Grant Date -
Feb 16, 2012
app pub date -
Aug 30, 2010
filing date -
Aug 12, 2010
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a heat sink, a number of pipes connecting the heat sink to the heat dissipation block, and a plate plugged in a socket of the motherboard. The heat sink is mounted to the plate.
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