Dimple forming apparatus and dimple forming method
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United States of America Patent
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Jun 26, 2012
Grant Date -
Dec 30, 2010
app pub date -
Jun 29, 2009
filing date -
Jun 29, 2009
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A dimple forming apparatus for forming dimple on a workpiece at a desired position comprises a base mold with a concave surface, a heating unit and a forming pin with a spherical surface. The base mold is configured to be positioned below the workpiece. The heating unit is configured to heat the desired position of the workpiece for enhancing tractility of the desired position of the workpiece, and the forming pin is configured to be positioned above workpiece with the spherical surface of the forming pin aiming toward the desired position of the workpiece heated by the heating unit. The heating unit successfully enhances the tractility of desired position of the workpiece before the desired position of the workpiece is punched by the forming pin, and produces low stress at the junction of the dimple formed by the forming pin punching and the workpiece of the workpiece. The present invention also discloses a dimple forming method, a head gimbal assembly and a method for manufacturing a head gimbal assembly.
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