Winding component
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United States of America Patent
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Jun 19, 2012
Grant Date -
Dec 10, 2009
app pub date -
Jan 24, 2007
filing date -
Jan 30, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
[Problems] To realize a structure that is substantially highly reliable, that solves a problem of a wire break accompanied by an application of an external force to a terminal and at the same time solves a problem of a wire break caused by heat effects during dip soldering, without causing a strength reduction of the terminal, cost increase, and wire thinning.
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