Method for inspecting a surface of a wafer with regions of different detection sensitivity
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United States of America Patent
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Jun 12, 2012
Grant Date -
Jun 25, 2009
app pub date -
Dec 9, 2008
filing date -
Dec 20, 2007
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Abstract
The invention relates to a method for inspecting a surface of a wafer with regions of different detection sensitivity. For this purpose, an image of the selected surface of the wafer is acquired using a detector. At least one region handled with a different detection sensitivity than the rest of the wafer may be defined on the surface of the wafer by means of an input unit. The detection sensitivity set for the regions is a percentage less than the detection sensitivity for the surface of the wafer without the regions with the different detection sensitivity.
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