Resist cover film forming material, resist pattern forming method, and electronic device and method for manufacturing the same
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United States of America Patent
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Jun 12, 2012
Grant Date -
Sep 11, 2008
app pub date -
Jul 31, 2007
filing date -
Aug 30, 2006
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Abstract
To provide a material including: a silicon-containing polymer having at least an alkali-soluble group and is represented by the following general formula (1); and an organic solvent capable of dissolving the silicon-containing polymer.
where R1 represents at least one of a monovalent organic group, hydrogen atom and hydroxyl group, R2 represents at least one of a monovalent organic group and hydrogen atom (where R1 and R2 each may appear twice or more, and at least one of R1 and R2 contains an alkali-soluble group), “t” represents an integer of 1 to 3, “a,” “b,” and “c” represent the relative proportions of their units (where a≧0, b≧0 and c≧0, and “a,” “b,” and “c” are not 0 at the same time), and (R1tSiO(4-t)/2)b may appear twice or more.
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