Method for holding and carrying substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8196292
APP PUB NO 20100050430A1
SERIAL NO

12548863

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A part cartridge for a mounter device used in a mounting process for mounting electronic parts on a substrate by heating the substrate to a predetermined temperature after the electronic parts are mounted on the substrate put on a conveying carrier by the mounter device, comprising holding part holding the substrate in the state of being fitted to the conveying carrier, and a guide tape holding the holding part. The holding member is stored in the state of being wound together with the guide tape so that the holding part can be mounted on the conveying carrier by the mounter device. By this, a method of holding and carrying the substrate for mounting the holding part on the conveying carrier by using the mounter device can be adopted in the mounting process. The deflection of the substrate in reflow can be securely prevented while suppressing cost by effectively utilizing the existing mounting line and devices.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
DAISHO DENSHI CO LTDTOKYO 145-0071

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Annou, Koji Tochigi-ken, JP 2 4
Deguchi, Osamu Tochigi-ken, JP 4 22
Ishikawa, Atsushi Tochigi-ken, JP 171 1500
Kimura, Akihiro Tochigi-ken, JP 206 3047

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