Method for manufacturing leads
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United States of America Patent
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Jun 12, 2012
Grant Date -
May 8, 2008
app pub date -
Nov 5, 2007
filing date -
Nov 6, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system method for manufacturing leads is provided. The method includes providing a conductive sheet, shaping the conductive sheet into at least two opposing longitudinal strips and a plurality of interposing strips, masking lateral sides and a center of the plurality of interposing strips, covering the exposed surface with a conductor and severing the conductive sheet at least along center mask. The plurality of interposing strips are preferably flexible and configurable into desired shapes for potential future attachment to an integrated circuit.
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