Fabricating method and structure of a wafer level module
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United States of America Patent
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Jun 5, 2012
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N/A
app pub date -
Dec 23, 2009
filing date -
Sep 2, 2009
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Abstract
A fabricating method includes adhering an exposed surface of a first solid adhesive film to a first substrate. The second surface of the first solid adhesive film is exposed and adhered to a second substrate. A third substrate is adhered to a second substrate via a patterned second solid adhesive film, and a diaphragm layer is adhered to the third substrate via a patterned third solid adhesive film. A fourth solid adhesive film with a removable release film is adhered to the first substrate covered, followed by slicing to form wafer level lens modules.
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