Adhesive layer composition for in-mold decoration

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United States of America Patent

PATENT NO 8192837
APP PUB NO 20090098362A1
SERIAL NO

12337478

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Abstract

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This invention relates to compositions suitable for the formation of an adhesive layer used for in-mold decoration. This invention also relates to in-mold decoration tape or strip, comprising: a carrier layer; a release layer; a durable layer; and an adhesive layer which comprises an adhesive binder, a polymeric particulate material and an inorganic particulate material.

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Patent Owner(s)

Patent OwnerAddress
ETANSI INCNO 22 BEIYUAN RD JHONGLI CITY TAOYUAN COUNTY 32063

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jing-Den San Jose, US 16 400
Liang, Rong-Chang Cupertino, US 216 8130
Pereria, Cheri Fremont, US 2 14
Wang, Pei-Lin San Jose, US 10 39
Wang, Xiaojia Fremont, US 62 2342

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