Pressure sensitive sensor and manufacturing method thereof
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United States of America Patent
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Jun 5, 2012
Grant Date -
Aug 4, 2011
app pub date -
Dec 21, 2010
filing date -
Jan 29, 2010
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A molten dielectric resin material is filled in a section of an inside of a hollow dielectric body, in which electrode wires are installed. The molten dielectric resin material is solidified to form filler resin, so that the hollow dielectric body has a sensor portion, in which the filler resin is not filled in the inside of the hollow dielectric body, and a non-sensor portion, in which the filler resin is filled in the inside of the hollow dielectric body. A power supply connector is installed to one end part of the hollow dielectric body located at the non-sensor portion side and includes a plurality of electrically conductive terminals that are electrically connected to the plurality of electrode wires.
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