Thin-film piezoelectric device, production method thereof, head gimbals assembly using the thin-film piezoelectric device, and hard disk using the head gimbals assembly
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United States of America Patent
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May 29, 2012
Grant Date -
Apr 22, 2010
app pub date -
Oct 15, 2009
filing date -
Oct 21, 2008
priority date (Note) -
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Abstract
A method includes a step of stacking a first electrode layer, a piezoelectric layer, and a second electrode layer on a first substrate to form a first laminate; a step of stacking a support layer on a second substrate to form a second laminate; a step of bonding the first and second laminates through an adhesive layer to form a third laminate; a step of removing the first substrate from the third laminate; a step of processing the third laminate in a desired shape; and a step of removing the second substrate. A Young's modulus of the adhesive layer is smaller than a Young's modulus of the piezoelectric layer. Respective Young's moduli of the second electrode layer and the support layer are larger than the Young's modulus of the adhesive layer. The third laminate has no other piezoelectric layer except for the aforementioned piezoelectric layer.
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