Flex-rigid printed wiring board and manufacturing method thereof

United States of America Patent

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May 29, 2012
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Mar 4, 2010
app pub date
Sep 21, 2006
filing date
Sep 21, 2006

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Abstract

A flex-rigid printed wiring board is provided which can retain flexibility of a flexible portion while increasing durability of the flexible portion against folding, and can ensure conduction in a rigid portion, and a method of manufacturing the printed wiring board.

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Patent Owner(s)

Patent Owner	Address
TOHOKU UNIVERSITY	SENDAI PREFECTURE MIYAGI PREFECTURE JAPAN SENDAI-SHI MIYAGI
DAISHO DENSHI CO LTD	TOKYO 145-0071

International Classification(s)

H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

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Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Morimoto, Akihiro	Sendai, JP	99	956
Ohmi, Tadahiro	Sendai, JP	798	14083
Sasaki, Masahiro	Ichinoseki, JP	101	946
Sato, Akihiro	Ichinoseki, JP	210	2699

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Flex-rigid printed wiring board and manufacturing method thereof

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United States of America Patent

12442016

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PATENT NO	8188372
APP PUB NO	20100051325A1
SERIAL NO	12442016
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 29, 2012	US,8188372,B2 US8188372B2	GRANTED PATENT AS SECOND PUBLICATION
March 04, 2010	US,20100051325,A1 US20100051325A1	FIRST PUBLISHED PATENT APPLICATION

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