Photosensitive resin composition and photosensitive film

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United States of America Patent

PATENT NO 8187788
APP PUB NO 20090191385A1
SERIAL NO

12226227

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Abstract

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Disclosed is a photosensitive resin composition comprising an alkali-soluble resin, wherein the dissolution rate of the alkali-soluble resin in an aqueous sodium carbonate solution is not less than 0.04 μm/sec. When a photosensitive layer having a thickness of 30 μm is formed by applying the photosensitive resin composition onto a base and removing the solvent by heating, and thus-obtained photosensitive layer is irradiated with an active ray of 1000 mJ/cm2 or less, the dissolution rate of the portion irradiated with the active ray in the photosensitive layer made of the photosensitive resin composition is not less than 0.22 μm/sec and the film residual rate of the portion not irradiated with the active ray is not less than 90%.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI KABUSHIKI KAISHATOKYO JAPAN TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayakawa, Takashi Tokyo, JP 71 525
Miyazaki, Kuon Tokyo, JP 12 54

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