Circuit materials, circuits laminates, and method of manufacture thereof
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United States of America Patent
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May 29, 2012
Grant Date -
Jan 21, 2010
app pub date -
Jul 17, 2009
filing date -
Jul 18, 2008
priority date (Note) -
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Abstract
A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.
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