Metallic panel assembly having multilayer arrays of micropores

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8186866
APP PUB NO 20090175440A1
SERIAL NO

12018897

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A metallic panel assembly having multilayer arrays of micropores includes a backlight module and a panel body. The backlight module is constituted of a first and a second light-guiding plate. First and second light-guiding microstructures are provided on the first and second light-guiding plates. A first and a second set of light-emitting units are disposed on one end of the first and second light-guiding plates, respectively. A first and a second shielding unit are disposed on the first and second light-guiding plates and the first and second sets of light-emitting units respectively. The panel body is disposed on one side surface of the first light-guiding plate. The panel body has thereon a plurality of hollowed portions with the hollowed portions encircling a key body. The key body has thereon a plurality of micropores. The plurality of micropores is arranged to form a pattern of each key body. When the first or second set of light-emitting units are lighted up, the light enters one side of the first or second light-guiding plate. The light is reflected by the first or second light-guiding microstructures on the corresponding key panel, so that the user can see the position of each key clearly.

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Patent Owner(s)

Patent OwnerAddress
ICHIA TECHNOLOGIES INCNO 268 HUAYA 2ND RD GUISHAN DIST TAOYUAN CITY 333

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, Chang-Li Taoyuan, TW 23 170
Wu, Che-Tung Taoyuan, TW 19 47

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